RSiC Furnace Thermal Shield Plate Chamber Fittings
PRODUCT DESCRIPTION
RSiC thermal shield plate is a key component in high-temperature equipment such as diffusion furnaces, CVD furnaces, annealing furnaces, etc. RSiC thermal shield plate plays an important role in reducing heat loss, maintaining temperature uniformity, and protecting external structures.The main functions of furnace thermal shield plate include:
Thermal insulation: used in heat treatment and LPCVD processes to carry silicon boats, effectively blocking heat transfer and achieving efficient insulation;
Improve temperature uniformity: With the help of multi-layer reflection or insulation design, promote the balanced distribution of heat field in the furnace, and control the temperature difference within the range of ± 1-2 ℃;
Mechanical support function: RSiC thermal shield plates provide a solid and stable support foundation for heating elements, process tubes, or chip carrying devices.
Characteristics of RSiC Furnace Thermal Shield Plate
High temperature resistance: can work stably for a long time in an environment of 800~1600 ℃, adapting to different process requirements;
Low thermal conductivity: The thermal conductivity at room temperature is usually below 1W/(m · K), effectively suppressing heat conduction;
Chemical inertness: Resistant to corrosion from various process gases (such as O ₂, H ₂, HCl, etc.), maintaining stable performance;
High purity material: With extremely low impurity content, RSiC thermal shield plate prevents volatile substances from contaminating the wafer at high temperatures;
Lightweight structure: With a small heat capacity, thermal shield plate helps to achieve rapid heating and cooling, improving process efficiency.
FEATURES & BENEFITS
· High temperature resistance
· Thermal shock resistance
· High thermal conductivity
· High mechanical strength
· Acid and alkali resistance
· Wear resistance
MAIN PARAMETER
High Temperature Kiln Equipment Industry | RSiC |
SiC Content (%) | ≥99% |
Bulk Density (g/cm3) | 2.65~2.75 |
Apparent Porosity (%) | <17 |
Room temperaturestrength (MPa) | 90~100 |
Strengthat 1300℃(MPa) | 100-110 |
Elasticity modulus at 20℃ | 240 |
Thermal Conductivity At 1200℃(W/mk) | 36 |
Thermal Expansion x10-6/℃ | 4.6 |
Max Using Temperature（℃） | 1650℃ |
Hardness At 20°C (Kg/mm2) | 2000 |
Fracture Toughness At 20°(MpaxM1/2) | 2.0 |
PRODUCT DETAIL
Semiconductor shield plate is far from a simple "insulation material". It is a key functional component that integrates insulation, temperature equalization, load-bearing, anti fouling, and efficiency enhancement, directly related to the performance, efficiency, yield, and cost of semiconductor manufacturing processes.
PACKING
OUR ADVANTAGES
Riseport Global Traders Ltd. (Shenyang) delivers global clients high-quality products through an efficient production system equipped with advanced technology, ensuring both superior quality and rapid response. Supported by diversified logistics solutions that integrate sea, air, and land transport, we provide seamless end-to-end service to guarantee safe and timely delivery worldwide.We specialize in providing precise specifications based on your needs, from non-standard sizes to complete OEM/ODM designs.
